SCHMID’s InfinityLine L+ secures Innovation Award at productronica 2025

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FREUDENSTADT, Germany, Nov. 18, 2025 — The SCHMID Group (NASDAQ: SHMD) proudly announces that its InfinityLine L+ received the Innovation Award productronica 2025 in the PCB & EMS Cluster category. This accolade acknowledges SCHMID’s innovative impact on advanced manufacturing processes with its unique Chemical Mechanical Planarization (CMP) technology for large-format substrates.

The InfinityLine L+ facilitates CMP processing for rectangular substrates and PCBs measuring up to 24.5” × 24.5”, ensuring exceptional flatness and uniformity. This system is especially well-suited for advanced build-up technologies in panel level packaging and SLP uses, encompassing SCHMID’s proprietary “Àny layer ET-Board,” alongside SAP, TGV, and glass substrate methodologies. It represents a critical technology for achieving sub-5 µm structures within high-volume production.

“Securing the Innovation Award at productronica 2025 reinforces SCHMID’s position as a technological frontrunner in sophisticated electronics manufacturing,” stated Christian Schmid, CEO of the SCHMID Group. “The InfinityLine L+ exemplifies how our dedication to innovation, teamwork, and engineering prowess persistently influences the progression of sustainable, high-performance production solutions.”

Addressing novel challenges in substrate fabrication

The processing of extensive, delicate, and brittle materials introduces distinct difficulties. Standard CMP systems are generally restricted to wafers of up to Ø300 mm and are incapable of handling the slender, frequently flexible properties of large panels. Discrepancies in layer thickness, material compositions, and surface features necessitate accurate regulation and substantial throughput, criteria that surpass conventional wafer-centric CMP principles.

An innovative method for planarization

The InfinityLine L+ incorporates a revolutionary design: slurry is delivered centrally and uniformly dispersed across the substrate via the polishing pad. Delicate substrates are held and secured by a specialized clamping and backing mechanism. Its advanced zone control, accurate endpoint detection, and automated panel swapping capabilities guarantee optimal flatness, operational consistency, and efficiency with reduced idle periods.

“This recognition confirms our technological objective to extend semiconductor-level CMP accuracy to significantly larger substrates,” clarified Steffen Beck, Director of Technology at SCHMID. “The InfinityLine L+ represents a genuine advancement, facilitating sub-5 µm structures, superior uniformity, and adaptable automation for sophisticated packaging, SLP, and glass substrate uses.”

Technological aspects and advantages

Functioning based on SCHMID’s “Oscar” principle, the InfinityLine L+ achieves a combination of reduced slurry usage, rapid material removal rates, and superior uniformity. Capabilities like platen cooling, adjustable pressure regulation, and vacuum clamping with real-time pressure observation further boost operational dependability.
Its adaptable, modular construction enables quick replacement of consumables and continuous oversight of all process variables, ensuring consistent outcomes and peak operational availability.

Target applications and markets

  • Producers of substrates for Artificial Intelligence and developing technologies
  • Makers of high-end SLP and advanced packaging solutions
  • Companies manufacturing glass-core and other substrate types
  • Enterprises in photonics and optoelectronics
  • Academic and research institutions specializing in microsystems, material science, and electronics

Setting a new standard in advanced packaging

By effectively connecting semiconductor wafer processes with the requirements of future substrate technologies, SCHMID’s InfinityLine L+ establishes a novel industry benchmark. It integrates accuracy, versatility, and automation, offering a scalable solution prepared for cluster integration, supporting up to four systems, complete automated loading and unloading through FOUP, and optional incorporation with the InfinityLine H+ inline cleaning system.

Our gratitude to all contributors who facilitated this achievement!

Statements Regarding Future Prospects

This press release includes declarations identified as “forward-looking statements.” Any statement within this release that is not a historical fact falls under the category of forward-looking statements. Such statements are dependent on numerous variables, many of which the Company cannot influence, including those detailed in the “Risk Factors” section of the Company’s registration statement and offering prospectus submitted to the SEC. Access to these documents is provided on the SEC’s website, . The Company disclaims any responsibility to revise or update these statements following the release date, unless legally mandated.

Concerning the SCHMID Group

The SCHMID Group stands as a world-renowned innovator delivering high-tech industry solutions across electronics, photovoltaics, glass, and energy systems. SCHMID N.V. and Gebr. SCHMID GmbH maintain their primary offices in Freudenstadt, Germany. Established in 1864, the corporation presently employs more than 800 individuals globally and runs technology hubs and manufacturing sites in various regions, such as Germany and China, complemented by multiple international sales and service points. The Group’s core mission involves creating bespoke equipment and process methodologies for diverse sectors, including electronics, sustainable energy, and energy storage. Our comprehensive system and process offerings for fabricating substrates, printed circuit boards, and other electronic parts guarantee advanced technology, elevated yields at competitive production expenses, optimal efficiency, superior quality, and environmental responsibility through eco-conscious manufacturing techniques.
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