SCHMID Group Enhances Advanced Packaging Portfolio for the AI Era

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The introduction of new InfinityLine products and glass core substrate solutions establishes SCHMID as a crucial facilitator for the advanced packaging requirements of the future.

FREUDENSTADT, Germany, Oct. 08, 2025 — The SCHMID Group, a prominent worldwide supplier of equipment and solutions for the electronics sector, has declared a significant enhancement of its product range to address the rapidly increasing need for two product categories: advanced packaging substrates and high-performance server boards, driven by the era of Artificial Intelligence (AI).

The emergence of AI is fundamentally transforming the semiconductor industry. Worldwide industry experts forecast a compound annual growth rate (CAGR) of approximately 10% for the semiconductor and advanced packaging segment in the coming five years. Leading companies like TSMC and NVIDIA are spearheading innovation in chip manufacturing and advocating for novel advanced packaging approaches.

Concurrently, the conventional PCB industry is anticipated to expand at an 8% CAGR, with AI server boards exhibiting the most robust growth (a CAGR of roughly 20%). IC-Substrates are projected to see a 15% CAGR increase, driven by trends toward miniaturization and the necessity for innovative interconnect solutions.

SCHMID Broadens Its Equipment Range

To capitalize on these expanding markets, SCHMID has enhanced its InfinityLine product lineup:

  • The established InfinityLine H+ continues as SCHMID’s leading equipment in sales, experiencing significant growth consistent with market trends.
  • The current InfinityLine V+ addresses the requirements for progressively intricate high-end PCBs.
  • The new InfinityLine C+ is poised to become SCHMID’s second most significant revenue generator.
  • The new InfinityLine L+, a Chemical Mechanical Planarization (CMP) solution designed for panel-level substrates, and
  • The new InfinityLine P+, SCHMID’s subsequent iteration of single panel plating equipment, both scheduled for introduction in late 2025, are essential for fulfilling the needs of future substrate and AI-Server-PCB applications.

Leveraging its current product lines alongside its newly developed and launched production machinery, SCHMID is established as a frontrunner in facilitating next-generation package substrates and AI-server PCBs, supported by an even more extensive product portfolio.

Facilitating Advanced Substrates

Beyond the InfinityLine product range, SCHMID is advancing technological innovation through:

  • SCHMID QuantumLine and SCHMID-AVACO Plasma Equipment, which allow for high-yield production of glass core substrates.
  • SCHMID ET-Board technology, which facilitates Cu-damascene manufacturing at the panel level, enabling widespread miniaturization.

Given the rising demand from AI companies for Chip-on-Wafer-on-PCB (CoWoP) solutions, SCHMID holds a distinct advantage in providing industry-leading yield and the most economical cost of ownership.

Positive Projections

Given its broadened product range and robust standing in rapidly expanding markets, SCHMID foresees 2025 as a year of transition. Beginning in 2026, the company predicts growth surpassing market averages, especially from its AI-focused product lines. These sectors are expected to contribute significantly to growth in 2026 and 2027, becoming the main contributors to SCHMID’s total revenue increase.

Statement from Executive

“The age of AI is profoundly reshaping the electronics and semiconductor sectors. SCHMID is honored to supply the essential technologies that facilitate glass core substrates, panel-level Cu damascene, and production systems for advanced AI-server boards. Through our enhanced InfinityLine portfolio, we are prepared to spearhead this evolution alongside our clients,” stated Christian Schmid, CEO of SCHMID Group.

Anticipatory Statements

This news release features statements categorized as “forward-looking statements.” Any declarations within this press release, apart from those detailing historical facts, are considered forward-looking statements. These forward-looking statements are dependent on various conditions, many of which are outside the Company’s control, including those specified in the “Risk Factors” section of the Company’s registration statement and final prospectus for the offering submitted to the SEC. Access to these documents is available on the SEC’s website, . The Company does not commit to updating these statements for any revisions or changes occurring after the publication date of this release, unless legally mandated.

Regarding the SCHMID Group

The SCHMID Group stands as a global leader in delivering solutions for the high-tech industry across electronics, photovoltaics, glass, and energy systems. SCHMID N.V. and Gebr. SCHMID GmbH maintain their primary offices in Freudenstadt, Germany. Established in 1864, the company presently employs more than 800 individuals worldwide and manages technology centers and manufacturing plants in numerous locations, including Germany and China, in addition to several international sales and service points. The Group’s focus is on crafting bespoke equipment and process solutions for diverse sectors, such as electronics, renewable energy, and energy storage. Our system and process offerings for manufacturing substrates, printed circuit boards, and other electronic parts guarantee state-of-the-art technology, high productivity at reduced manufacturing expenses, peak efficiency, superior quality, and environmental responsibility via sustainable production methods.
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